1. 2. 3. material content data sheet sales product name ipp120p04p4-04 issued 29. august 2013 ma# MA000892176 package pg-to220-3-1 weight* 2036.80 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 5.301 0.26 0.26 2602 2602 leadframe non noble metal iron 7439-89-6 0.816 0.04 401 inorganic material phosphorus 7723-14-0 0.245 0.01 120 non noble metal copper 7440-50-8 815.335 40.05 40.10 400302 400824 wire non noble metal aluminium 7429-90-5 9.913 0.49 0.49 4867 4867 encapsulation organic material carbon black 1333-86-4 8.840 0.43 4340 plastics epoxy resin - 97.239 4.77 47741 inorganic material silicondioxide 60676-86-0 483.249 23.73 28.93 237260 289341 leadfinish non noble metal tin 7440-31-5 21.462 1.05 1.05 10537 10537 plating non noble metal nickel 7440-02-0 0.244 0.01 120 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 1 120 solder noble metal silver 7440-22-4 0.098 0.00 48 non noble metal tin 7440-31-5 0.078 0.00 38 non noble metal lead 7439-92-1 3.741 0.18 0.18 1837 1923 heatspreader inorganic material phosphorus 7723-14-0 0.177 0.01 87 non noble metal iron 7439-89-6 0.590 0.03 290 non noble metal copper 7440-50-8 589.466 28.94 28.98 289409 289786 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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